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SM / SMP — Silver Ball Matrix Sockets

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SM / SMP

Package Types BGA, LGA, QFN, CSP, PoP, WLP
Pitch Range 0.25mm – 1.27mm
Bandwidth >40 GHz @-1dB
Temperature Range -55°C to +150°C
Insertion Life >500,000 cycles (with plunger matrix)
Contact Resistance <15 mΩ

Silver ball matrix contact technology for high speed, low inductance, high endurance, and wide temperature applications, with an optional protective plunger matrix for production test environments demanding minimal downtime.

SM sockets suspend silver balls in a non-conductive elastomer at 50-ohm impedance with a solid core for durability, while SMP adds a gold-plated copper plunger matrix on top for >500,000 cycles and protection from solder ball contamination. The socket sits 2.5mm per side larger than the IC and handles up to 100W with heat sink integration; lid options include swivel, clamshell, and double latch, with hardware, epoxy, or SMT emulator base mounting.

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Overview

SM/SMP sockets combine high bandwidth, very low inductance, and wide temperature capability with exceptional endurance, covering the broadest range of package types in Ironwood’s socket family, including PoP and WLP devices from 0.25mm pitch.