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IC Sockets & Adapters: Grypper®

G80 LIF Grypper

Package Types BGA
Pitch Range 0.65mm+
Footprint Net Zero (identical to package)
Ball Count 200+ (G80) / 300+ (G80 LIF)
Lid Not required
G80 LIF Reduced insertion force for high I/O devices

Net zero package footprint engineering test socket for larger pitch, higher ball count BGA devices. G80 LIF adds reduced insertion force for packages above 300 balls, where standard insertion forces risk damage to high I/O devices.

The G80 Grypper handles BGAs at 0.65mm+ pitch with 200+ balls using the Grypper family’s net zero footprint and no-lid snap-fit design, keeping the topside open for probing and rework. G80 LIF extends the range past 300 balls by reducing per-ball insertion force while holding retention; RF characterisation covers 0.45, 0.50, and 0.60mm balls at 0.8mm and 1.0mm pitch, with PCB support guidance for larger builds.

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Overview

G80 and G80 LIF are the Grypper solutions for larger pitch, higher I/O BGA packages. G80 covers devices above 200 balls; G80 LIF addresses the insertion force challenge for devices above 300 balls, keeping net zero footprint and full topside access throughout.