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IC Sockets & Adapters: Grypper®

G35 Grypper

Package Types BGA
Pitch Range ~0.35mm
Footprint Net Zero (identical to package)
Lid Not required
Insertion Force Low
Signal Path Short — low inductance, low insertion loss

Net zero package footprint engineering test socket for fine pitch BGA devices at ~0.35mm pitch. The PCB footprint of the Grypper is identical to the IC package, which means only one PCB design is required across test, validation, and production.

The G35 Grypper uses a contact design with oxide-cutting wipe action. The contact wipes the side of the solder ball during insertion, breaking through solder oxides for a reliable electrical connection. No lid is required; the package snaps directly into the socket, keeping the topside of the device accessible for probing, scoping, and troubleshooting.

A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection. The unique contact design reduces insertion force required to safely retain fine pitch, lower ball count packages within the socket.

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Overview

The G35 is Ironwood’s Grypper solution for the finest pitch BGA devices at ~0.35mm. Net zero footprint means a single PCB design takes you from engineering test through production, eliminating the board redesign cost typical of conventional sockets.