SBT / CBT — Stamped Spring Pin Sockets
SBT / CBT
- Package Types BGA, LGA, QFN, QFP, SOIC
- Pitch Range 0.3mm – 1.27mm
- Bandwidth 4 GHz – 31.7 GHz @-1dB
- Temperature Range -55°C to +180°C
- Insertion Life >500,000 cycles
- Contact Resistance <15 mΩ
Stamped spring pin contact technology for burn-in and test applications demanding wide temperature range and high endurance, with better electrical and mechanical performance than conventional pogo pin sockets.
SBT’s stamped Beryllium Copper contact combines an outer spring, inner leaf spring, and stainless steel core, assembled on an automated zero-defect line and rated for 500,000 cycles across -55°C to +180°C in a footprint 2.5mm per side larger than the chip. The socket geometry matches GHz elastomer and Giga-Spring footprints for switching contact tech on the same PCB, with screw, epoxy, or SMT emulator base mounting and optional clamshell lids for hand test and burn-in.
Overview
SBT/CBT sockets are Ironwood’s stamped spring pin solution — delivering high endurance and wide temperature performance across BGA, LGA, QFN, QFP, and SOIC packages from 0.3mm pitch. The preferred choice for burn-in and production test environments where cycle life and temperature range are the primary selection criteria.
Specifications
- Bandwidth: 4 GHz – 31.7 GHz @-1dB
- Contact resistance: <15 mΩ
- Self inductance: 0.88 – 0.95 nH
- Capacitance: <0.3 pF
- Operating temperature: -55°C to +180°C
- Insertion life: >500,000 cycles
- Current rating: 4A – 8A per pin (at 80°C temperature rise)
- Pitch: 0.3mm – 1.27mm
Additional Information
- Package types: BGA, LGA, QFN, QFP, SOIC
- Mounting: Hardware mount, epoxy mount, SMT emulator base
- Lid options: Swivel lid, clamshell lid
- Certifications: ISO 9001, RoHS compliant
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