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IC Sockets & Adapters: Grypper®

Grypper Y

Package Types BGA (no equator / small solder ball exposure)
Pitch Range 0.35mm+
Footprint Near Zero (1mm larger than DUT)
Insertion Force <25 grams
Removal Force ~3 grams per contact
Insertions per Device 40+

Near zero footprint test socket for BGA devices with no equator or minimal solder ball exposure, where the standard Grypper contact cannot reliably hold. The Y contact shape and sliding lid deliver reliable contact and device retention in high vibration applications.

Grypper Y handles BGAs where solder balls have no equator or minimal substrate exposure, packages that standard Grypper contacts can’t grip reliably, using a Y-shaped contact with a wiping action that’s gentle enough for 40+ insertions of the same device. Insertion force runs below 25g per contact (screw-adjusted on the sliding lid) with ~3g removal; the lid can integrate heat sinking, and the footprint sits just 1mm larger than the DUT for direct drop-in to production PCB locations.

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Overview

Grypper Y solves the problem the standard Grypper cannot, BGA devices where minimal solder ball exposure makes gripping unreliable. Near zero footprint, ultra-low insertion force, 40+ insertions of the same device, and optional heat sinking in the sliding lid.