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ATS-730E

Temperature Range -90°C to +225°C
Transition — Heating -55 to +125°C, <10 sec
Transition — Cooling +125 to -55°C, <10 sec
Airflow 4 – 18 scfm
Power 200–250 VAC (230V nominal), 50/60Hz, 30A, 1 phase
Form Factor Mobile floor unit (M or T configuration)

The ATS-730E extends the ATS mobile series to -90°C — 10°C colder than the ATS-710E, for MIL-STD and defence-grade electronics testing, RF component characterisation at extended cold limits, and failure analysis requiring temperatures beyond the standard -80°C floor.

The additional 10°C of cold range relative to the ATS-710E directly addresses test requirements that commercial-grade thermal forcing cannot reach: MIL-STD-810 cold storage and operating profiles, extended temperature semiconductors for aerospace and defence applications, and RF or mixed-signal components characterised to -85°C or -90°C junction temperatures under self-heating conditions.

Transition speed and DUT control architecture are identical to the rest of the ATS mobile family — sub-10-second transitions between -55°C and +125°C, proprietary DUT temperature control algorithm, integrated purging, Quick-connect caps, and E Series embedded software with no Windows OS dependency.

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Overview

The ATS-730E goes to -90°C — the choice in the ATS mobile range when MIL-STD or extended-temperature semiconductor testing requires colder than -80°C.

Specifications

Temperature range: -90°C to +225°C
Heating transition: -55 to +125°C, <10 sec
Cooling transition: +125 to -55°C, <10 sec
Airflow: 4–18 scfm continuous
Temperature accuracy: ±1.0°C
Power: 200–250 VAC (230V nominal), 50/60Hz, 30A, 1 phase
Configurations: M (articulated arm), T (turret + hose)

Additional Information

Interfaces: IEEE-488, RS-232
Features: E Series embedded software; integrated purging; Quick-connect thermal caps; MIL-STD capable
No LN2 or LCO2 required
Made in USA