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ATS-750E

Temperature Range -90°C to +300°C
Transition — Heating -40 to +125°C, <12 sec
Transition — Cooling +125 to -40°C, <40 sec
Airflow 4 – 18 scfm
Power 200–250 VAC (230V nominal), 50/60Hz, 30A, 1 phase
Form Factor Mobile floor unit (M or T configuration)

The ATS-750E extends the hot end of the ATS mobile range to +300°C — for high-power electronics, gallium nitride (GaN) power devices, automotive-grade component testing, and any application where +225°C is not the upper limit of the required test envelope.

The ATS-750E is built for the exceptions: high-temperature semiconductors, power modules, GaN RF devices, wide-bandgap power electronics, and automotive components tested to powertrain operating temperature extremes.

The cold floor remains -90°C, matching the ATS-730E, so the ATS-750E covers the widest total temperature span in the ATS mobile range. DUT direct control, E Series embedded software, integrated purging, and Quick-connect thermal cap compatibility are all standard.

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Overview

The ATS-750E is the extended hot-range model in the ATS mobile series — -90°C to +300°C for high-power electronics, GaN devices, and automotive-grade testing where the standard +225°C ceiling is not enough.

Specifications

Temperature range: -90°C to +300°C
Transition — Heating: -40 to +125°C, <12 sec
Transition — Cooling: +125 to -40°C, <40 sec
Airflow: 4–18 scfm continuous
Temperature accuracy: ±1.0°C
Power: 200–250 VAC (230V nominal), 50/60Hz, 30A, 1 phase
Configurations: M (articulated arm), T (turret + hose)

Additional Information

Interfaces: IEEE-488, RS-232
Features: E Series embedded software; integrated purging; Quick-connect thermal caps; MIL-STD capable
No LN2 or LCO2 required
Made in USA